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Non-sintering Preparation of Copper (II) Oxide Powder for Electroplating via 2-step Chemical Reaction
Seung Bum Lee, Rae Yoon Jung, Sunhoe Kim
J. Electrochem. Sci. Technol. 2017;8(2):146-154. Published online 2017 Jun 30 DOI: https://doi.org/10.5229/JECST.2017.8.2.146
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Citations to this article as recorded by
 Manufacturing of Copper(II) Oxide Powder for Electroplating from NaClO3 Type Etching Wastes
In Kwon Hong, Seung Bum Lee, Sunhoe Kim
Journal of Electrochemical Science and Technology.2020; 11(1): 60. CrossRef Copper(II) oxide powder manufacture for via-filling plating from H2O2 type etching wastes
Seung Bum Lee, Rae Yoon Jung, Sunhoe Kim
Journal of Industrial and Engineering Chemistry.2019; 79: 418. CrossRef Preparation of CuO powder for electroplating using lead frame etching wastes
Seung Bum Lee, Rae Yoon Jung, Sunhoe Kim
Journal of Industrial and Engineering Chemistry.2018; 64: 116. CrossRef
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