[1] C. Cotell, J. Sprague and FA. Smidt Jr, ASM Hand Book. 5, ASM International, USA, 1994.
[2] M. Schlesinger and M. Paunovic, Modern Electroplating. John Wiley & Sons, New Jersey,
2010.
[3] RE. Tucker, Metal Finishing. Elsevier, New York, 2011.
[4] T. Norseth,
Eviron Health Perspect,
1981,
40, 121–130.
[5] VS. Protsenko and FI. Danilov,
Clean Technol Environ Policy,
2014,
16, 1201–1206.
[6] T. Hall, E. Taylor and M. Inman, Plating Surf Finish, 2010, 2(9), 675–686.
[7] A. Liang, Q. Liu and B. Zhang,
Mater Lett,
2014,
119, 131–134.
[8] A. Liang, L. Ni and Q. Liu,
Surf Coat Technol,
2013,
218, 23–29.
[9] FI. Danilov, VS. Protsenko and VO. Gordiienko,
Appl Surf Sci,
2011,
257(
18), 8048–8053.
[10] R. Giovanardi and G. Orlando,
Surf Coat Technol,
2011,
205(
15), 3947–3955.
[11] D. Del Pianta, J. Frayret and C. Gleyzes,
Electrochimica Acta,
2018,
284, 234–241.
[12] I. Drela, J. Szynkarczuk and J. Kubicki,
J Appl Electrochem,
1989,
19(
6), 933–936.
[13] J. Mcdougall, M. El-Sharif and S. Ma,
J Appl Electrochem,
1998,
28(
9), 929–934.
[14] JHOJ. Wijenberg, M. Steegh and MP. Aarnts,
Electrochimica Acta,
2015,
173, 819–826.
[15] W. Simka, D. Puszczyk and G. Nawrat,
Electrochimica Acta,
2009,
54(
23), 5307–5319.
[16] W. Liu, G. Liu, X. Saijun and J. Zhang,
Int J Electrochem Sci,
2017,
12, 1589–1599.
[17] G. Saravanan and S. Mohan,
J Appl Electrochem,
2009,
39(
8), 1393–1397.
[18] S. Survilienė, S. Eugenio and R. Vilar,
J Appl Electrochem,
2011,
41(
1), 107–114.
[19] F. Liu, Y. Deng and X. Han,
J Alloys Compd,
2016,
654, 163–170.
[20] AP. Abbott and KJ. McKenzie,
Phys Chem Chem Phys,
2006,
8(
37), 4265–4279.
[21] VS. Protsenko, LS. Bobrova and DE. Golubtsov,
Russ J Appl Chem,
2018,
91(
7), 1106–1111.
[22] EL. Smith, AP. Abbott and KS. Ryder,
Chem Rev,
2014,
114(
21), 11060–111082.
[23] AP. Abbott, G. Capper and DL. Davies,
Chem–Eur J,
2004,
10(
15), 3769–3774.
[24] AP. Abbott, PD. Al-Barzinjyand and AA. Abbott,
Phys Chem Chem Phys,
2014,
16(
19), 9047–9055.
[25] V. Protsenko, L. Bobrova and F. Danilov,
Anti-Corros Method M,
2018,
65(
5), 499–505.
[26] I. Mejia-Caballero, J. Aldana-Gonzalez and TL. Manh,
J Electrochem Soc,
2018,
165(
9), D393–401.
[27] IG. David, DE. Popa and M. Buleandra,
J Anal Methods Chem,
2017, 1–22.
[28] MR. Majidi, K. Asadpour-Zeynali and B. Hafezi,
Electrochim-ica Acta,
2009,
54(
3), 1119–1126.
[29] M. Rezaei, SH. Tabaian and DF. Haghshenas,
Electrochimica Acta,
2012,
59, 360–366.
[30] EB. Budevski, GT. Staikovand and WJ. Lorenz, Electrochemical Phase Formation and Growth: An Introduction to the Initial Stages of Metal Deposition. VCH, New York and Weinheim,
1996.
[31] B. Scharifker and G. Hills,
Electrochimica Acta,
1983,
28(
7), 879–889.
[32] M. Palomar-Pardave, BR. Scharifker and EM. Arce,
Electrochimica Acta,
2005,
50(
24), 4736–4745.
[33] K. Skrzypczyńska, K. Kuśmierek and A. Świątkowski,
Int J Electrochem Sci,
2018,
13, 88–100.
[34] E. Laviron,
J Electroanal Chem,
1979,
101, 19–28.
[35] JT. Hinatsu and FR. Foulkes,
Can J Chem Eng,
1991,
69(
2), 571–577.
[36] D. Yue, Y. Jia and Y. Yao,
Electrochimica Acta,
2012,
65, 30–36.
[37] A. Urcezino, L. dos Santos, P. Casciano and J. Braz, Chem Soc, 2017, 28(7), 1193–1203.
[38] AA. Kityk, VS. Protsenko and FI. Danilov,
J Electroanal Chem,
2013,
689, 269–275.
[39] R. Seeber, C. Zanardi and G. Inzelt, ChemTexts, 2018, 1–18.